About Us: For over six decades, our team of skilled thinkers, makers, and doers has embraced the mission to solve complex technology challenges across the U.S. and around the globe. We are the leading provider of high reliability and radiation assured solutions for defense, space, intelligence, commercial, and civil applications. Our products are designed to perform in the harshest of environments, from human spaceflight and space exploration to missile defense, electronic warfare, and healthcare tech advancements. Our talented team stays in lockstep with our customers to ensure the success of their missions. Why Work For Us: We take care of our people and provide competitive health, wealth, and wellbeing benefits from day one. Youll also discover learning and development opportunities to take your career to the next level and beyond. Other benefits include: Competitive Benefits: Medical (FSA + HSA), Dental, and Vision Immediate 401K Vesting/Matching Career Opportunity and Growth Tuition Reimbursement Student Loan Repayment Generous PTO and 11 paid Holidays per year (8 regular and 3 floating) 8 weeks of 100% Paid Family Leave Profit Sharing Plan applies to all non-Annual Incentive Plan and non-Sales Incentive Plan employees. Summary: The Package Engineer IV performs a variety of duties associated with the design of packages for semiconductor products. This role leads complex Integrated Circuit package design, mechanical and electrical analysis, process development, and process improvement efforts related to analog, digital, and/or mixed signal integrated circuits. Hiring Immediately! Responsibilities: Key Responsibilities: Execute Integrated Circuit package design assignments using ceramic, plastic, and organic materials typically creating complex new designs, including heterogeneous materials. Research, identify, and work with suppliers to develop new substrates, materials, interconnects, and lids based on product requirements. Develop and apply new processes for power package designs and apply results to improve package and product performance. Identify, select, and work with vendors to obtain quotes from suppliers and select preferred vendors for package materials as needed for new product development and procurement of materials. Work with Process Engineering to establish, improve, and incorporate package design guidelines for ease of assembly and/or manufacturability, including heterogeneous package technology. Apply complex thermal, mechanical, and parasitic modeling techniques to support product performance requirements, including analyzing multi-chip SoC packages. Define PCB requirements for high reliability applications. Interface with Electrical Engineers, Mechanical Engineers, and material suppliers to determine the correct approach to design, modify, or enhance the manufacturability of products. Qualifications: Qualifications & Experience: Bachelors degree in Mechanical Engineering or Electrical Engineering. Minimum of eight (8) years of experience in designing Integrated Circuit Packaging. Proficiency in CAD Software. Proficiency in Microsoft Office Suite. Strong understanding of Engineering Design Principles. Knowledge of Material Science. Understanding of Electrical Theory. Expertise in Packaging Engineering. Strong Problem-Solving skills. Ability to perform Requirements Analysis. Attention to Detail. Product and Technical Knowledge. Additional Information: This position requires access to technology, materials, software, or hardware that is controlled by either ITAR or EAR U.S. export laws. As a condition to this job offer, in order to be employed in this position, you must be able to obtain a U.S. Government export license(s), as required by law. Pay Range: $123,745 - $154,681.00 annually. Applicable pay within the posted range may vary based on factors including, but not limited to, geographical location, job function of the position, education, and experience of the successful candidate.
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For this position you must be currently authorized to work in the United States. We do not sponsor for this position.
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